FlipChip Bonder

INTRODUCTION

 FC3000W series

Features

 • Able to handle 12-inch wafers

 • A variety of temperature, pressure, and height profile settings are possible due to its own unique ceramic heater, and control method for pressure and position.

 • Able to achieve high accuracy (±2 μm) with its moving search function and highly stiff frame.

 • Able to achieve the most appropriate gap with its unique head gap control function.

 • Can be used for low pressure to high pressure regions by changing over the head.