Your Benefits with Heraeus Die Top System:

Best Performance:

• Die current capability increases >50 % vs. Aluminum wire
• 50x longer lifetime vs. solder die attach and Al-wire
• Reduced peak temperature across the die
• Enables higher junction temperatures of more than 200 °C
• Superior robustness vs. other solutions (e.g. clips)

Simplified Industrialization:

• Use of wire bonding, the most common interconnect technology in Electronics
• One sinter step for bottom and top die attach
• Pre-tested and perfectly matched material system
• Same equipment covers all layout variances from pilot to serial production

Highest Flexibility:

• DTS is adaptable to any die
• Tailored to customer specific designs

Maximized Profitability:

• Maximized chip power density
• Downsizing of cooling system
• Minimized total cost of ownership for advanced die connections