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RNM Dynamics welcomes SPT - Small Precision Tools as Our Newest Partner
We are excited to officially announce our partnership with SPT - small precision tools! This collaboration marks a new milestone for RNM Dynamics Phils. Inc. as we continue our commitment to innovation, growth, and delivering exceptional value.
HANMI Semiconductor, 7th Plant for HBM TC BONDER Groundbreaking Ceremony
HANMI Semiconductor has started building its 7th plant focused on producing High Bandwidth Memory (HBM) TC BONDERS. The new facility aims to meet increasing global demand from clients like NVIDIA and Broadcom. Expected to be completed by the end of this year, the plant will also produce next-generation AI and HBM4 products. Read more...
HANMI Semiconductor, Official Sponsor of '2025 SEMICON Korea' Exhibition
ANMI Semiconductor will introduce TC BONDER 3.0CW, a 2.5D packaging bonder that attaches AI GPUs and HBM semiconductors to silicon interposers, as well as the world's market-leading 7th generation new 'micro SAW & VISION PLACEMENT 6.0 GRIFFIN'. Read more...
Heraeus Electronics Wins 2024 Mexico Technology Award for Innovative Sinter Paste
Heraeus Electronics ("Heraeus"), a leader in electronic materials solutions, is proud to announce that its innovative product, magiCu PE401 Cu Sinter Paste, has been honored with the 2024 Mexico Technology Award in the category of 'Sinter Paste' Read more...
Thomas Muhleck is the new CEO of Kurtz Ersa
Kurtz Ersa CEO Thomas Muhleck was not only honored for 30 years of service by Advisory Board Chairman Rainer Kurtz, but was also appointed CEO and thus Chairman of the Management Board of the Kurtz Ersa Group. Read more...
HANMI first-launched 7th gen. of new micro SAW & VISION PLACEMENT in SEMICON Taiwan
HANMI Semiconductor announced on the 4th that they have introducing '7th generation new micro SAW & VISION PLACEMENT 6.0 GRIFFIN' for the first time and have participating as an official sponsor in 2024 SEMICON Taiwan. Read more...
HANMI Semiconductor launched 'HBM 6-SIDE INSPECTION 1.0'
HANMI Semiconductor introduced 'HBM 6-SIDE INSPECTION 1.0' equipment, which is essential for manufacturing 'high-bandwidth memory (HBM)' for artificial intelligence (AI) semiconductors. Read more...
Plaque of Appreciation given to RNM Dynamics Phils. Inc. by SMC Corporation
A plaque of appreciation to RNM Dynamics Phils. Inc. in recognation for the partnership in "EXPERTISE IN MOTION" SMC Technology Show 2019